Skip to main content

Objective:

Learn how to use the Thermal Bonded Contact block.

Procedure:

In the figure below, a user would like to tie a copper slug into an aluminum frame. The CAD model on the left represents the geometry of the two materials and the subsequent mesh of the two regions is on the right. Since the FEA meshes of two regions do not necessarily share common nodes and element faces it is necessary to “tie” these two regions together mathematically. As such, this approach allows the user to mathematically “bond” two different objects (of different materials) together and couple them thermally.  The imported CAD geometry is on the left and the meshed model is on the right To tie these two materials together the user would use the Thermal Bonded Contact block. This block creates a bonded contact between two FE boundaries which allows for heat flux between the two components.  The Thermal Bonded Contact block Contact resistance can be defined to account for thin membrane material at the boundary such as thermal paste. The contact resistance between two materials is often calculated from experimental tests of contact conductance. A table of values is provided below with some common materials. Table 1: Thermal contact conductance of some metal surfaces (from various sources)
MaterialSurface ConditionRoughness (µm)Temperature (°C)Pressure (MPa)hc* (W/m²·°C)
Identical Metal Pairs
416 Stainless steelGround2.5490–2000.3–2.53,800
304 Stainless steelGround1.14204–71,900
AluminumGround2.541501.2–2.511,400
CopperGround1.27201.2–20143,000
CopperMilled3.81201–555,500
Copper (vacuum)Milled0.25300.7–711,400
Dissimilar Metal Pairs
Stainless steel-Aluminum-20–302010–202,900–3,600
Stainless steel-Aluminum-1.0–2.02010–2016,400–20,800
Steel Ct-30-AluminumGround1.4–2.02010–3550,000–59,000
Steel Ct-30-AluminumMilled4.5–7.22010–304,800–8,300
Aluminum-CopperGround1.3–1.4205–1542,000–56,000
Aluminum-CopperMilled4.4–4.52010–3512,000–22,000
*Divide the given values by 5.678 to convert to Btu/h · ft2 · °F. It should be noted that the Thermal Bonded Contact block requires Thermal Contact Resistance and the table above provides conductance values. It is required to perform some math operations to get conductance values properly input into the block.  Using values from the articles conductivity table, we can create the thermal contact resistance variable. With the contact resistance properly computed it is necessary to tie the two meshes together as shown in the image below, using the Thermal Bonded Contact block.  The meshed model showing the connection faces for the Thermal Bonded Contact block. To properly include Bonded Contact in your FEA analysis you must use include the Thermal Bonded Contact block in the “Connectors” input of your Simulation Model as shown in the image below.  The notebook setup for the Simulation Model. It shows each of the FE Meshes were used to create Solid Domains. These Domains are connected using the Thermal Bonded Contact. Once your thermal boundary conditions are input you can now run your thermal analysis using bonded contact!  The thermal analysis results that were calculated using the Simulation Model and boundary conditions. Are you still having issues? Contact the support team, and we’ll be happy to help!

Download the Example File:

More on this topic: